Abstract
High resolution thermal images of semiconductor micro refrigerators are presented. Using the thermoreflectance method and a high dynamic range PIN array camera, thermal images with 50 mK temperature resolution and high spatial resolution are presented. This general method can be applied to any integrated circuit, and can be used as a tool for identifying fabrication failures. With further optimization of the experimental set-up, we expect to obtain thermal images with sub-micron spatial resolution.
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