Abstract
Differential calorimetry is used for studying the grain growth in nanocrystalline copper. The samples were prepared by compacting the small copper particles into a tablet-shaped solid in an opposed-targets sputtering system. The grain-growth process starts at temperatures around 400 to 450 K. The total enthalpy change due to grain growth is measured to be about 1200 to 1700 J/mol. The activation energy for grain growth is found to be 1.05 ± 0.05 eV. The average enthalpic part of the grain-boundary energy is found to be about 0.7 J/m 2, implying that the grain-boundary energy in these nanocrystalline copper samples is about the same as that found in conventional polycrystalline copper.
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