Abstract
In this paper, we report the experimental results for calibration of a 2D piezoresistive stress sensor using a four-point bending fixture. The sensor on the [100] test chips was able to accurately measure plane stress components in a temperature compensated manner. The resistance of stress sensors was found to vary linearly with the applied stress. The piezoresistive coefficient was calculated and found to coincide with the reported values for silicon. A further study of the thermally induced stresses was also carried out to determine the resistance change that varied linearly with temperature.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.