Abstract
In Chemical Mechanical Polishing (CMP), pad conditioning is a very important technique. Chip Manufactures have problems with semiconductor wafers getting scratched by the polishing waste and slurry waste particles on the surface and inside the pad. the polishing waste and slurry waste particles in the pad cause pad life to be too short. In this report, we will mention the development of a new cleaning system that uses water in a high-pressure micro jet system (HPMJ). We have confirmed the effect of the HPMJ as a conditioning tool on a suede type pads. It founds that HPMJ would be able to clean the polishing waste and slurry residues on the pad.
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