Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes

Abstract

Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.