Abstract
In the future, it is desired that high performance sensing module in small volume is realized. However, conventional MEMS (Micro Electro Mechanical Systems) packaging technology is becoming difficult to meet its desire (Especially Bulk MEMS). Small and package-less 3D sensing module, which consist of MEMS and IC chips bonded by SAB (Surface Activated Bonding) solves this problem (Fig. 1). But we have many technological opportunities in small and package-less 3D sensing module; Low damage bonding, electrical contact, and bonding alignment. This paper reports 'Bump-less wafer level bonding' which is needed for vertical integration MEMS device and the 3 wafer bonding experiment results of bonding strength, electrical contact, and alignment.
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