Abstract

In this paper, the series resistance of poly(3-hexylthiophene-2,5-diyl) (P3HT) and [6,6]-phenyl C61-butyric acid methyl ester (PCBM) bulk heterojunction (BHJ) organic solar cells (OSC) has been studied. The series resistance of thermal annealed and un-annealed devices with different active layer thicknesses was measured. The series resistance of the organic solar cells consists of the bulk resistance of the active layer itself and the specific contact resistance between the active layer and the electrode. The bulk resistance and contact resistance were extracted from the measured series resistance using the vertical transmission line model (TLM) method. By fabricating solar cell devices with different active layer thicknesses, a relationship of the series resistance with thickness was established from which bulk and contact resistances were derived. We have also found that thermal annealing helps reduce both contact resistance and bulk resistance significantly; the contact resistance dropped by a factor of 2, while the bulk resistance decreased by a factor of 8. Results have shown that for an annealed P3HT:PCBM device that has an active layer thickness of 85 nm (optimum thickness for high efficiency), 17% of the total series resistance was due to the contact resistance, and bulk resistance contributed the rest 83%. The bulk resistance value for thermal annealed organic solar cell device with an active area of 0.1 cm 2 was found to be 150 Ω, and the measured specific contact resistance was 3.1 Ω cm 2. The measured bulk and contact resistance values are much higher as compared to the high efficiency silicon solar cells. Bulk resistance and contact resistance need to be further decreased in order to achieve higher organic solar cell efficiency.

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