Abstract
Novel broadband microstrip to dielectric image line (DIL) transitions have been developed. A conducting strip is flared linearly from the microstrip line to the DIL. The DIL and microstrip substrate are on the same side of their common ground plane. Theoretical simulation results, obtained by using the finite-difference time-domain method, agree well with experimental results. The transitions should have applications in the integration of the dielectric image line with microwave integrated circuits (MICs) and monolithic microwave integrated circuits (MMICs).
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