Bright and Semi-Bright Nickel Plating from Low Metal/Low Temperature Solutions

Abstract

SummaryThe comparison is made between recently developed low concentration, low temperature bright nickel and semi-bright nickel plating processes and conventional bright nickel and semi-bright nickel processes in respect to the physical properties of the deposits, stress, ductility, levelling etc, and the tolerance of the solutions to impurities, operating current density range, cathode efficiency etc. Calculations are presented for the material and energy savings achieved by the use of these new low temperature, low concentration processes and some production experience is related.