Abstract
Electric field-assisted sintering technology (FAST) was used to join SiC ceramic by using a CoFeCrNiCu high-entropy alloy filler. A thin Ti film was deposited on SiC surface by physical vapor deposition to reduce the residual thermal stress in the joint. The microstructure, bending strength, and bonding mechanism were systematically investigated. It was found that a discontinuous TiC layer could be formed at the interface and the interfacial reaction products changed with different brazing temperatures. A joint with a bending strength of 72 MPa was achieved at 1200 °C, which is 73% higher than that of the SiC brazed without Ti coating. This work provides a new insight in the interfacial design of ceramic brazing with high mechanical properties.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
