Abstract
Organic complementary circuitry combines all the advantages of plastic electronics, such as flexibility, thinness, and solution processability with low power consumption. Here, we report organic complimentary inverters fabricated in a carrier-free batch process on a plastic foil with dielectric and semiconductor layers patterned using the high-volume gravure contact printing technique. The transistor components have bottom-gate, bottom-contact configuration with aluminum gates and gold contacts, allowing full use of photolithographic processing while protecting the semiconductors by depositing them last. Cross-linkable polymer dielectric, p-type small molecule and n-type polymer semiconductors are printed from inks based on nonchlorinated solvents. Printing instability is observed for capillary numbers approaching 1. The 430-nm-thick dielectric affords a relatively low operational voltage, and it is the thinnest printed organic dielectric reported in the literature for organic inverters to date. Both p- and n-type transistors have a mobility of 0.01–0.04 cm $^{2}\text{V}^{\mathrm {-1}}\text{s}^{\mathrm {-1}}$ . The device parameters for the n-type transistors show less variation than the p-type transistors, which can be related to the more isotropic charge transport in polymer films compared with the small-molecule polycrystalline films. The resultant inverters have an average gain of 4.5 ± 1.5 and a maximum gain of 8 at $V_{\mathrm {DD}} =-20$ V. The combination of the conventional photolithographic processing and gravure contact printing can therefore be used to fabricate bottom-gate organic complementary circuitry on plastic.
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