Abstract
A novel borazine-containing arylacetylene resin (PBZA) has been synthesized in high yield through condensation reaction between B,B′,B″-trichloroborazine and arylacetylene Grignard reagent, which are potential candidates as low dielectric constant material for microelectronic packaging and also radio and microwave frequency substrate. The PBZA is a brown viscous liquid and soluble in a variety of common solvents. PBZA could be cured by polymerization of alkynyl groups to form organic–inorganic hybrid structure containing borazine ring and aromatic rings with exothermic polymerization temperature in the 190–250 °C range and the structure exhibits great dependence on the substituent on borazine in PBZA. The cured PBZA exhibits high thermal stability with char yield up to nearly 80% at 1000 °C and great chemical stability. Especially, the cured PBZA shows low dielectric constant (ca. 2.7) and extremely low dielectric loss (<0.002). The cured PBZA under higer annealing temperatures exhibits lower dielectric constant and dielectric loss.
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