Abstract
Single crystal sapphire has excellent mechanical, optical and chemical properties which widen its applications but also make it a difficult-to-cut material. Currently, CMP (Chemical-Mechanical-Polishing) is used for sapphire substrate in its final finishing, but counts problems due to the nature of loose abrasive machining. CMG (Chemical-MechanicalGrinding) is a fixed abrasive process by integrating chemical reaction and mechanical grinding into one-stop process and shows advantages against CMP in finishing efficiency, geometric controllability, and waste disposal. So far, we have been succeeded in developing BAP (Bondless Abrasive Pellet) made of Cr2O3 for CMG of sapphire but due to lack of strength, it had a problem the amount of wear is higher than including a bond material. In order to enhance the wear resistance of BAP, in this report, sintering is added into the procedure of BAP manufacturing. Pellet wear, material removal rate and finished surface roughness are investigated when varying the sintering temperature.
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