Abstract
The objective of this paper was to evaluate the bonding behaviour of chemically modified wood particles towards an isocyanate resin system, as determined from internal bond strength of the board, and to determine which resin system, isocyanate or formaldehyde is suitable for use in boards made from modified raw material. It was found that chemical modification of wood chips and strands did not significantly affect the bonding efficiency of isocyanate resin, but the bonding efficiency of formaldehyde resins was strongly influenced. This behaviour can be a consequence of the usage of a less pH dependent resin that is fully cured during hot pressing in combination with the high mobility of the resin which causes penetration to considerable depth into compressed particles repairing weak zones, which are created during the modification process as chips are exposed to elevated temperatures, by sticking them together. It is suggested therefore, that the isocyanate resin system is more suitable for use in boards made from modified raw material than the formaldehyde resin system.
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