Abstract
In this paper, a method utilizing a charged-device model (CDM) test by the tape carrier package or chip-on-film (COF) samples to emulate the real-world board-level CDM or charged-board model (CBM) electrostatic discharge is proposed for large-sized chips such as liquid-crystal display (LCD) driver ICs, which successfully duplicated the same failure by CBM discharging. For small-sized chips, the evaluation board (or printed circuit board) emulation should minimize the parasitic <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RLC</i> loading of the interconnection on the board to achieve a more accurate CBM discharging. In addition, guidelines regarding chip-level design and layout optimization are proposed and have been successfully implemented to improve the immunity.
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