Abstract
Bismaleimides (BMI) modified polyethersulfone (PES)-epoxy interpenetrating networks were developed. Epoxy systems modified with 4%, 8%, and 12% (by wt) of polyethersulfone were made by using epoxy resin (DGEBA) and polyethersulfone with diaminodiphenylmethane as curing agent. The polyethersulfone-toughened epoxy systems were further modified with 4%, 8%, and 12% (by wt) of bismaleimides, namely 1,3-bismaleimiobenzene and 1,1'-bis(4-maleimidophenyl) cyclohexane. BMI-PES—Epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat deflection temperature (HDT) analysis. The DSC thermograms of polyethersulfone-modified epoxy and BMI-modified epoxy during cure show unimodal reaction exotherms. The studies indicate that thermal stability and resistance to water absorption of epoxy resin has been enhanced by the introduction of polyethersulfone. The incorporation of bismaleimide into unmodified epoxy and PES—epoxy enhanced the thermal and mechanical properties according to its percentage content. The morphologies of fractured surfaces of modified epoxy systems were compared with that of unmodified epoxy system.
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