Abstract

Composite overwrapped pressure vessels (COPVs) offer significant weight advantages over traditional all-metal vessels particularly in industries like aerospace, automotive and pharmaceutical, but pose unique challenges in mechanical design, fabrication, and testing. Despite their benefits, COPVs are susceptible to stress rupture failure, which can lead to catastrophic consequences during operation. This failure mode is not fully understood, with burst pressure-induced extreme stress concentrations and dynamic loading primarily contributing to rapid deformation and strain. To address these concerns, a comprehensive investigation was conducted, focusing on optimizing and examining the effects of optimum winding angle and lay-up pattern configuration on burst pressure in vessels under internal pressure. Finite element modeling analyzed the burst pressure behavior of COPVs with a 4 mm thick aluminum core cylinder and varying layers of carbon/fiber epoxy, each with a constant thickness. ABAQUS composite modeler generated 18 COPV models with carbon fiber/epoxy plies, ensuring uniform thicknesses while exploring different fiber orientations. The effects of ply stacking sequence were analyzed through finite element analysis for all models, comprising varying layers with uniform thicknesses. Attention was paid to failure criteria, methodically evaluating the burst strength of the Al/CFRPC COPVs This exhaustive analysis yielded an optimal COPV design profile characterized by a precisely calibrated ply stacking sequence of [24.50, −24.50] PP winding pattern and six (6) arranged layers. The stress-strain distribution analysis of the Composite Overwrapped Pressure Vessel (COPV) revealed both a uniform distribution of stress across its surface and extreme stress concentration, particularly peaking towards the polar boss region. This concentration is discernible due to variations in ply thickness induced by the overwrapped fiber orientation. This investigation provides valuable insights for optimizing COPV design and enhancing its performance and reliability in various applications.

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