Abstract
Polymer/oxide hybrid thin films, which have excellent electrical and mechanical performance, can be effectively fabricated through the sol-gel process, showing great potential in the future printed electronics. However, gelation of polymer/oxide ink systems can easily occur during a thermal process in which case capillary stress can lead to the crack of printed films due to the long period of stress accumulation. To solve this problem, the effect of different solvent systems on formed PAM/ZrOx hybrid films, which were printed by piezoelectric printing, was studied in this paper, including single solvent systems of glycol and binary solvent systems of glycol and water. The result showed that the microstructure characteristics and mechanical properties of hybrid nanostructures formed in different solvent systems varied significantly, and crack behavior can be regulated by simply adjusting the water volume ratio of the solvent system. The crack formation was significantly inhibited when the water volume ratio reached 25%.
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