Abstract
The purpose of this study is to investigate the effect of Bi addition to Ag-free and low Ag lead-free solder on their mechanical properties. The specimens used in this study were SC07 and SAC107 with and without Bi. Tensile tests for their specimens were carried out at various temperature (25, 80, and 120°C) under 1.0×10-3 s-1 strain rate. The addition of Bi into SC07 and SAC107 caused to increase their tensile strength. This is because Bi is dissolved in the primary Sn as a solid solution. The addition of Bi has no effect on their elongation. When test temperature increased, the addition of Bi had an effect on their tensile strength.
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