Abstract

AbstractIn this chapter, the effects of the addition of Fe and Bi on the mechanical properties, microstructures, electrical properties, corrosion, and oxidation behavior of Sn–0.7Cu (SC07) lead-free solder alloy are presented. The addition of Fe and Bi to the SC07 alloy leads to significant changes in the microstructure and chemical state of tin. The minor addition of Fe to binary SC07 alloys leads to the formation of an intermetallic FeSn2 compound with high resistivity. The addition of Bi forms a substitutional solid solution with Sn in the primary ß-Sn dendrites of the alloy. Fe improves and stabilizes the mechanical properties and drop resistance, while Bi strengthens the alloy by solid solution effect, lowers the melting temperature, and improves the wetting properties. The addition of Bi increases the yield strength and fracture toughness while decreasing the overall elongation. A smoother morphology of the SC07 alloy was observed, which favors the formation of a passive layer, providing higher resistance to iv corrosion. High resistance and low capacitance values of SC07 lead-free solder alloy were observed, indicating the formation of a compact and adherent passive layer on the surface of the alloys. Thus, the electrical properties and oxidation and corrosion behavior of the modified solder alloys are better than Sn–Pb and the commercial SAC solder alloys.KeywordsSn–0.7Cu alloyElectrical propertiesOxidationCorrosion

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