Abstract

Materials with high dielectric permittivity and low dielectric loss are important materials applied in electronic devices such as capacitors, gate dielectrics, memories, and power-storage devices. The polymer materials with good processability usually have low dielectric loss but low dielectric permittivity. Conventional high permittivity materials were prepared by introducing inorganic fillers such as BaTiO3, carbon black, silver and aluminum (Al) nanoparticles (NPs) into the polymers to improve the dielectric permittivity. However, large amount of fillers are difficult to be well dispersed in the organic polymer matrix, which may increase the dielectric loss. Herein, benzoxazine silane coupling agent (TES-BZ) was synthesized and used to modify the Al microparticles. The TES-BZ modified Al microparticles were characterized by FTIR and were introduced into benzoxazine/epoxy resins to prepare composite materials. Dielectric property measurement shows that the TES-BZ modified Al microparticles improved the dielectric permittivity and low down the dielectric loss.

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