Abstract
Two catalytic systems for electroless metal deposition have been investigated by means of Rutherford backscattering spectrometry (RBS). The well‐known tin sensitizer, palladium activator, two‐step catalyst had the main emphasis, but also a commercial one based on evaporated palladium was examined. The behavior of the two‐step catalyst was largely dependent on the substrates used. On , the Sn:Pd ratio was 1:1 with each. On carbon substrates, the Sn:Pd ratio was 1:4 with and . Both these results violate the simple reaction mechanism described by the equation . The commercial catalyst on polyimide containing on the surface behaved differently compared to the two‐step catalyst by diffusing into the deposited layer and thereby influencing its deposition rate.
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