Abstract

The epitaxial growth of 0.6[BaTiO3]–0.4[Bi(Mg2/3Nb1/3)O3] (BT–BMN) relaxor ferroelectric thin-films on (100) Nb doped SrTiO3 substrates has been achieved and the structure is investigated for high-temperature capacitor applications. The post growth annealing decreases the oxygen vacancy and other defects in BT–BMN films, resulting in the enhancement of dielectric constant. An insertion of intermediate SrRuO3 layers as an electrode instead of Pt, sandwiching the film, is found to be more effective in enhancing the dielectric constant. A very high dielectric constant exceeding 400 was achieved from high-temperature annealed film and the film showed an excellent dielectric constant stability of below 11% in the temperature range of 80–400 °C. This will enable smaller, high-temperature tolerant, monolithically integrated thin-film capacitors on power semiconductor devices.

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