Abstract
A method is developed for the fabrication of sub-100 nm current-perpendicular spin-valve junctions with low contact resistance. The approach is to use a batch-fabricated trilayer template with the junction features defined by a metal stencil layer and an undercut in the insulator. The spin-valve thin film stack is deposited afterwards into the stencil, with the insulator undercut providing the necessary magnetic isolation. Using this approach, reproducible spin-current-induced magnetic switching is demonstrated for junctions down to 50 nm×100 nm in size.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
