Abstract
This article validates the technical feasibility of making one layer experimental particleboard from bamboo chips bonded with UF resin. Bamboo chips were characterised by having higher length to thickness and length to width ratios and lower bulk density than industrial wood chip particles. The rate of heat transfer to the core was approximately the same in the two mats, probably reflecting the same values of bulk density between bamboo and wood chips. The results obtained in this study showed that bamboo chips can be successfully used, as an alternative lignocellulosic raw material, to manufacture P3 boards for interior fitments using a relatively low resin dosage (10% UF). The more stringent ANSI criteria, however, required 14% UF resin and 1% wax to satisfy the 8% TS criteria. Combinations of bamboo chips with industrial wood chips and application of other resin systems may be an avenue for exploration in further investigations.
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