Abstract
Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies.
Highlights
The automotive industry is undergoing a paradigm shift in electrification
The flip-chip soldering technique was used instead of wire bonds to improve the current distribution and lifetime of the die interconnection. Baseplate materials such as AlSiC were replaced by ceramic substrates with a CTE that matches that of silicon to mitigate the thermal stress
In a press-pack power module, joints are formed by pressure-based bonding, which is simpler and more reliable compared to other connection methods, such as wire bonding, soldering, and sintering
Summary
The automotive industry is undergoing a paradigm shift in electrification. During the past decades, the electrified vehicle market has been booming [1]. Proper packaging design is necessary to construct a device from bare semiconductor chips Both discrete devices and multichip modules are adopted in the automotive application. Complex vibration loads from the traction system and the road condition put higher reliability requirements on the module, including sufficient mechanical strength, proper sealing, and reliable connectors For these reasons, the design of automotive modules is more complicated, and there is an urgent need to develop advanced technology [8], [9]. The precision and reliability of manufacturing processes, such as soldering and sintering, would be more difficult due to the reduced footprint and compact layout These challenges seem unavoidable in future power modules, especially when conventional silicon (Si) devices are being replaced by wide bandgap (WBG) devices that have a smaller footprint.
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