Automatic optical inspection for detecting defects on printed circuit board inner layers

Abstract

This paper studies automatic optical inspection for detecting defects on the printed circuit board inner layer. The development of this study can be divided into five stages, they are reference image rebuilding, inspection image normalization, image subtraction, defects separation and defect classification. In the image subtraction stage, the difference between the reference image from the printed circuit board design and the inspected image is checked for defects. Each defect region is separated using a defect outer boundary tracing method. A boundary state transition method is proposed to classify the defect types. This system can recognize eight defect types, open, mouse bite, pinhole, missing conductor, short, spur, excess copper and missing hole. In addition, a comparison with the methods described in the literature is made, proving that the proposed method produces better results .