Abstract
A diffusion bonding technique free of interlayer and external pressure was introduced, and the bonding pressure was generated due to linear shrinkage of Ti(C,N)-based cermet and thermal expansion of steel. The Ti, Ni, Fe concentrations across the joint evolved gradually and binder-riched surface layer, Fe–Co bonded cermet layer and austenite layer formed successively. The tensile residual stress decreased and the stress concentration region transferred away from the cermet side to the steel side. Diffusion bonding was combined with the liquid phase sintering process, and the cermet substrate need not to be heated twice. Compared with traditional method, the joint strength is improved due to graded microstructure, residual stress decrease and bonding process simplification.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
