Augmentation of Thermal Conductivity for Polypropylene / Ethylene-vinyl Acetate Based Composites Filled by Organic and Inorganic Particles

Rashed Al Mizan,Md Aminul Islam

doi:10.13189/ujms.2018.060201

Abstract

Emerging thermal dissipation of many electronic devices, i.e. light emitting diodes, energy storage components, CPU chips etc. as well as in many emergent new applications (smart textile, self-assembling materials, etc.) is a great challenge. The reliance of thermal conductivity of composites on the filler loading, filler networking morphology and on the whole composite structure is also discussed. This work is intended to design composites for the improvement of thermal conductivity of polypropylene and ethylene-vinyl acetate copolymer with lower filler contents. As filler both organic (activated carbon) and inorganic (alumina) materials alone or in a combination of various relative proportions have been used. An internal blending unit was used for melting the copolymer and proper mixing the filler particles with the molten matrix. Final composites were made by the hot press. Then Lee's Disc apparatus was used to measure the thermal conductivity of various composite samples by steady-state method. Experimental results show that only carbon black addition was not adequate to increase the thermal conductivity of the composites to expected level. The experimental value compare with some theoretical model to describe the prediction value accuracy for such multiphase composite. However, addition of small amount of alumina powder with carbon black significantly increased the copolymer composites.

Highlights

Thermal management is perilous to the performance, lifetime, and reliability of electronic devices
There are many studies done on the particle size and content in the composite, determining the average interparticle space [4,5], which is close related to the thermal conductivity and mechanical properties
The distribution of the particles varies with particle content and particle size, which determines the properties of the composites. [16]

Summary

Introduction

Thermal management is perilous to the performance, lifetime, and reliability of electronic devices. Carbon black, activated carbon and alumina, for example, have very high potential in respect of thermal and electrical conductivities. As a consequence, these fillers can be used to alter thermally and electrically insulating polymer into conductive materials [1] and to increase their mechanical properties at the same time. There are many studies done on the particle size and content in the composite, determining the average interparticle space [4,5], which is close related to the thermal conductivity and mechanical properties. The optimization of the particle size and content can be a suitable and viable way to prepare composites with good synthetic properties. [11]

Methods

Results

Conclusion