Abstract

The thermal conductivity of epoxy resin composites filled with combustion-synthesized hexagonal boron nitride (h-BN) particles was investigated. The mixing of the composite constituents was carried out by either a dry method (involving no use of solvent) for low filler loadings or a solvent method (using acetone as solvent) for higher filler loadings. It was found that surface treatment of the h-BN particles using the silane 3-glycidoxypropyltrimethoxysilane (GPTMS) increases the thermal conductivity of the resultant composites in a lesser amount compared to the values reported by other studies. This was explained by the fact that the combustion synthesized h-BN particles contain less –OH or active sites on the surface, thus adsorbing less amounts of GPTMS. However, the thermal conductivity of the composites filled with the combustion synthesized h-BN was found to be comparable to that with commercially available h-BN reported in other studies. The thermal conductivity of the composites was found to be higher when larger h-BN particles were used. The thermal conductivity was also found to increase with increasing filler content to a maximum and then begin to decrease with further increases in this content. In addition to the effect of higher porosity at higher filler contents, more horizontally oriented h-BN particles formed at higher filler loadings (perhaps due to pressing during formation of the composites) were suggested to be a factor causing this decrease of the thermal conductivity. The measured thermal conductivities were compared to theoretical predictions based on the Nielsen and Lewis theory. The theoretical predictions were found to be lower than the experimental values at low filler contents (< 60 vol %) and became increasing higher than the experimental values at high filler contents (> 60 vol %).

Highlights

  • IntroductionAs microelectronic devices have become more integrated and denser, heat dissipation has become an important problem because heat generation can increase the temperature of devices causing fatal damage and induce thermal fatigue that reduced operational efficiency and service life [1,2,3]

  • As microelectronic devices have become more integrated and denser, heat dissipation has become an important problem because heat generation can increase the temperature of devices causing fatal damage and induce thermal fatigue that reduced operational efficiency and service life [1,2,3].To solve this problem, application of high thermal conductivity materials is necessary in addition to the design of devices for heat dissipation

  • Thermal conductivity of cresol Novolac epoxy (CNE) resin filled with combustion-synthesized hexagonal boron nitride (h-boron nitride (BN)) particles was investigated

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Summary

Introduction

As microelectronic devices have become more integrated and denser, heat dissipation has become an important problem because heat generation can increase the temperature of devices causing fatal damage and induce thermal fatigue that reduced operational efficiency and service life [1,2,3] To solve this problem, application of high thermal conductivity materials is necessary in addition to the design of devices for heat dissipation. Due to poor affinity between the naked (untreated) h-BN particles and epoxy resin, pores (or voids) are formed at the interface, resulting in a high thermal conduction barrier These pores (or voids) can be reduced by improving the interface affinity by some type of surface treatment. Different synthesis methods may produce h-BN particles with different surface properties, which may affect the effectiveness of any surface treatment and create different interface environments, affecting the thermal conduction resistance and resulting in different thermal conductivity. Effects of the surface treatment of h-BN particles with GPTMS, a type of silane, particle size and filler loading on thermal conductivity were investigated and the measured thermal conductivities were compared with theoretical predictions based on the Nielsen and Lewis equation

Examination of Surface Treatment
Effect
Density and Porosity of Composites
Effects of h-BN Particle Size and Loading on Thermal Conductivity
Thermal Conductivity Model
Materials
Surface Treatment of h-BN Powder
Fabrication of h-BN-Filled Epoxy Resin Composites
Characterization of h-BN Powder and h-BN-Filled EMC Epoxy Resin Composites
Conclusions
Full Text
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