Abstract
A fluxless soldering technique has been developed for the attachment of optoelectronic components to silicon submounts by laser soldering of gold-coated indium solder pads. By keeping the solder time per pad at 60 msec, and by adhering to a solder schedule that minimizes the formation of indium oxide, it is possible to solder without flux or the need of an inert atmosphere. The method is demonstrated on a high speed data link consisting of a laser, an external modulator, and a laser back facet detector attached to a silicon submount.
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