Abstract
Hierarchical microstructures spanning from micro-sized eutectic structure to nano-sized precipitates are promisingly engineered in lightweight Al alloys to improve the high-temperature creep resistance that is increasingly required for rapid industrial development. However, the intrinsically-brittle eutectic phase is ready to fracture upon applied loading, which, dramatically reducing room-temperature ductility and fracture toughness, greatly hampers practical applications of the creep-resistant Al alloys. Here, through the combination of Sc microalloying with sub-rapid solidification, we observe the ductilization of Al11Ce3 eutectic phase in cast heat-resistant Al-Ce-Sc alloys due to the formation of atomic-scale compositional complexity. High-concentration Sc atoms are frozen within the Al11Ce3 intermetallic phase by the sub-rapid solidification, which then assemble into unusual atomic-scale compositional dipoles with the Sc atoms enriched at one pole and the Al atoms at the opposite during subsequent heat treatment. The dispersed Sc-Al compositional dipoles induce local lattice distortions that stimulate dislocation activities, as temporally and spatially visualized by in-situ neutron diffraction tensile test and microstructural characterizations. The unexpected plastic deformation triggered in Al11Ce3 improves the deformation compatibility between the eutectic phases, enabling the sub-rapidly-solidified Al-Ce-Sc alloy to reach a room-temperature tensile elongation 3 times and fracture toughness over 8 times of its counterpart derived from traditional solidification. In addition, the sub-rapidly-solidified Al-Ce-Sc alloy exhibits an excellent creep resistance at 300 °C, achieving a tensile creep stress threshold of ∼ 70 MPa. These findings provide new perspectives on the design of ductile intermetallic phases and the development of creep-resistant Al alloys with application-level ductility.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
