Atomic layer deposition mechanism of hafnium dioxide using hafnium precursor with amino ligands and water

Abstract

As a unique nanofabrication technology, atomic layer deposition (ALD) has been widely used for the preparation of various materials in the fields of microelectronics, energy and catalysis. Hafnium dioxide (HfO2), as an excellent high-κ oxide, is widely used as a substitute gate dielectric for conventional SiO2 in field effect transistor devices. Currently, HfO2 high-κ gate dielectric in MOSFET devices was prepared via ALD technology using tetrakis(dimethylamino)hafnium(IV) (Hf(NMe2)4, TDMAHf) and water (H2O) as the precursors. In this work, the complicated surface reaction mechanism of HfO2 H2O-based ALD using Hf(NMe2)4 was investigated using density functional theory calculations. In the TDMAHf reaction, the dimethylamino group of the precursor was eliminated by ligand exchange reaction with the hydroxyl group on the surface. Subsequently, a second dimethylamino group of TDMAHf could further be eliminated by another hydroxyl group on the surface. In the H2O reaction, ligand exchange reactions and coupling reactions could both occur. By the ligand exchange reactions, water molecule could react with the dimethylamino group on the surface. Simultaneously, the hydroxyl and amino groups could also react with neighboring hydroxyl groups to eliminate dimethylamine and water molecules via the coupling reactions. All these insights into the complicated surface reaction mechanism of H2O-based ALD could promote the further development of ALD chemistry and materials.