Abstract
Amorphous silicon oxycarbide (a‐SiOC:H) films produced by remote plasma RPCVD from diethoxymethylsilane (DEMS) were characterized in terms of their basic properties related to the coatings deposited using conventional plasma enhanced PECVD method. The effect of substrate temperature (TS) on the growth rate, chemical composition, structure, and properties of resulting a‐SiOC:H films is reported. Film growth is an adsorption‐controlled process, wherein two mechanisms can be distinguished with a transition at about TS=70°C. Depending on the temperature, films of different nature can be obtained, from polymer‐like to highly crosslinked material with C‐Si‐O network. The chemical structure of a‐SiOC:H films was characterized by FTIR, 13C and 29Si solid‐state NMR, and X‐ray photoelectron spectroscopes. The a‐SiOC:H films were also characterized in terms of their density, refractive index, surface morphology, conformality of coverage, hardness, adhesion to a substrate, and friction coefficient. The films were found to be morphologically homogeneous materials exhibiting good conformality of coverage and small surface roughness. Their refractive index exhibits anomalous effect revealing a minimum value at TS=125°C. Due to their exceptional physical properties a‐SiOC:H films produced by RPCVD from DEMS precursor seems to be useful as potential dielectric materials or coatings for various encapsulation applications.
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