Abstract
Experimental measurement techniques for the determination of stress levels and distributions will be one of most important keys for the optimization of the design of the next generation electronic packages, e.g., nano-wafer-level packages. However, current experimental photo-mechanics techniques are often found to be insufficiently sensitive but also lacking in sufficient resolution to determine stress distributions of nanoscale electronic packages. In this study, the digital image speckle correlation method was combined with the atomic force microscopy (AFM) to develop a new experimental measurement technique, so-called nanodigital image speckle correlation (Nano-DiSC), for the determination of deformation on the nanometer scale. With the developed theoretical model, computational algorithms and nanospeckle pattern preparation method, the Nano-DiSC methodology was found to be able to measure the in-plane deformation on the sub-10 nm scale.
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