Abstract
When fabricating microscopic features in SiO2 layers using low pressure, high-density fluorocarbon plasmas, microtrenching has commonly been observed. Microtrenching has been explained either as due to ion scattering from sloped sidewalls or negative charging of the sidewalls by electrons, and the influence of the associated electric field on ion trajectories. In this work, we show that a weak magnetic field produces a significant asymmetry in microtrenching. Our results demonstrate unambiguously that electron-based sidewall charging is to a significant extent responsible for microtrenching, and, more generally, that differential charging is an important effect in microstructure fabrication using high-density plasmas.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call