Abstract

This article assesses, for the first time, a body/bulk built-in current sensor (BBICS) in a CMOS 65-nm test chip under thermal neutron, high-energy neutron, and laser radiation. Experimental results suggest that the on-chip current sensor is effective to detect transient faults in different case-study subcircuits of the chip exposed to the accelerated radiation effects, opening prospects for embedding this type of sensor in reliable, secure, and low-power integrated circuit applications.

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