Abstract
EFAB{trade mark, serif} is a multilayer electrochemical microfabrication technology for the manufacture of truly 3-demensional (3-D) metal microdevices. Metal surface modification techniques can be applied to not only the EFAB process but also EFAB products. This paper first briefly introduces the applications of surface modification techniques in EFAB and then reports and discusses a surface treatment method for extending the use life of copper instant-masks (Cu-IM) used for instant-mask plating in EFAB. In this surface treatment process a copper substrate is immersed in a benzotriazole (BTA) solution to form a protective film on the copper substrate prior to the application of a patterned insulator layer. This protective film increases the delamination resistance of insulator layers on Cu-IMs in copper plating baths. Therefore the use life of Cu-IMs can be extended.
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