Abstract
Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS swatch are described. MEMS which use non-silicon materials as diamond, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.
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