Abstract
In chemical mechanical polishing (CMP), a two-stage polishing strategy is often employed. A high removal rate (RR) is set at the initial stage, then a lower RR is employed to remove residual metal and extended to the over-polish stage. An analogy between the soft landing of a spacecraft and CMP operation is established and the CMP operation can be viewed as a minimum-time optimal control problem. Measurement uncertainties prevent direct implementation of bang-bang control law for the entire polishing process. Thus, a two-stage CMP operation procedure is devised to ensure robust operation while maintaining a high throughput.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
