Abstract
AbstractRapid thermal processing chemical vapor deposition (RTP-CVD) has received considerable attention as a novel in-situ multi-processing tool capable of meeting the stringent requirements of ULSI device fabrication. In this paper, we review the progress made in developing and applying RTP-CVD to ULSI device fabrication. Research areas discussed include epitaxial Si and poly-Si growth, in-situ doping, selective growth, in-situ multi-processing, and novel dielectrics. In addition, the extension of RTP-CVD to novel materials such as GexSi1−x has produced device quality films with successful application in HBTs and Si-based optoelectronics.
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