Abstract
Power modules are key products used in various fields such as home appliances, information equipment, factory equipment, and transportation equipment. Research on power modules with long life and high reliability will greatly contribute to the realization of a low-carbon society. As an example, we considered an IGBT (Insulated Gate Bipolar Transistor). An important part of this is the joint between the wire and the semiconductor chip. Failure occurs at this joint due to repeated thermal loads due to operation of the power device. In this study, we focused on the wire lift-off phenomenon in which the Al wire separates from the Si chip due to thermal fatigue at the Al-Si joint, and thermo-elastic-plastic creep analysis of the crack tip is performed using the FEM mode. Regarding the influence of modified strain hardening of Al on thermal fatigue, the evaluation parameter ΔWin was investigated and report.
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