Abstract
Power modules are key energy saving products that are used in all types of power control and contribute to reducing power loss in various types of devices. One of the important parts of a power module is the joint between a wire and a semiconductor chip. This joint is damaged by repeated heat cycles caused by operation of the power device. An example of thermal fatigue damage is the wire-liftoff phenomenon, in which wires peel off from semiconductor chips. To evaluate thermal fatigue for this phenomenon, it is necessary to consider elasto-plastic deformation, thermal deformation, and creep deformation. Therefore, we investigated the use of T*-integral, in which path independence is established even in the presence of these deformations, for thermal fatigue evaluation of Al-Si joints. In this study, T*integral program was developed and the results of functional test of the program for tensile problems with central cracks are reported.
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