Application of a thermal circuit model for the prediction of interfacial thermal resistance between water and a nanostructure surface using molecular dynamics simulations

Abstract

The present study proposes various thermal circuit models (TCMs) to predict interfacial thermal resistances (ITRs) between water and a nanostructure surface. The effects of water models, nanopillar widths on nanostructure surfaces, and composite surfaces on the relationship between ITRs calculated by non-equilibrium molecular dynamics simulations and ITRs predicted by TCMs are investigated in water-copper and water-graphene-copper systems. The results reveal that the ITRs predicted by some TCMs are slightly affected by water pressure, while MD-calculated ITRs of the nanostructure surfaces in the Wenzel states agree with most of the predicted ITRs. Additionally, it is demonstrated that water molecules in the groove of a nanostructure surface play a crucial role in TCMs in the Cassie-Baxter states. Considering the effective contact region of water molecules in the groove in the Cassie-Baxter states, the use of TCMs can effectively reduce the prediction error of ITRs.