Application of a Genetic Algorithm Associated With Adhesive Joint Analysis to the IC Chip Pick-up Process

Abstract

In the condition investigated here, a concentrated force is applied to both IC chip and blue tape bonded by an adhesive under pin–pin boundary conditions. The experimental results show that even though IC chips of 0.1 mm thickness are subjected to a concentrated force of 4.8 N, they cannot be fully separated from the blue tape and fail easily during the pick-up process. However, when IC chips of 0.34 mm thickness are subjected to a concentrated force of only 3.5 N, they can be fully separated from the blue tape without breakage. These two experimental findings are then explored analytically by applying the C++ program of the genetic algorithm associated with adhesively bonded joint analysis to the IC chip pick-up process. In accordance with the experimental results, the results for the 0.1 mm thick IC chips reveal no solutions for the material properties or adhesive thickness to satisfy the conditions of the IC chip successful pick-up process, although those for the 0.34 mm thick IC chips show solutions for the values of both the elastic modulus and the adhesive layer's thickness. As regards the easy failure of IC chips with 0.1 mm thickness, if the blue tape's mechanical properties are appropriately chosen and then used in this process and its elastic modulus is greater than one-tenth that of the IC chips, the probability of the IC chips being fully separated from the blue tape can be expected to increase.