Study in IC chip failure during pick-up process by using experimental and finite element methods

Abstract

Stress contours of an IC chip and the displacement contours of the adhesive between an IC chip and blue tape in the pick-up integrated circuit (IC) chip process are obtained using experimental and finite element methods. The physical and mechanical properties of the material used in FEM are determined by pre-experimental tests. Some factors that importantly influence the failure of a pick-up IC chip during the pick-up IC chip process are proposed. The pre-experimental material properties are manifest in the practical behavior of material, so the post-experimental results are approximately consistent with the FEM results. Post-experiments further demonstrated that the findings of this study can be used to increase the success rate of the pick-up IC chip process.