Abstract
From the plenary talks to the industry sessions to the exhibit floor, reliability and production of wide-bandgap (WBG) devices were the buzzwords at this year's 34th IEEE Applied Power Electronics Conference and Exposition (APEC), which was held on 17-21 March at the Anaheim Convention Center in California. Besides presenting reliability data and highlighting the production status of gallium nitride (GaN) and silicon carbide (SiC) power devices, this premier conference in applied power electronics also presented seminars and papers on the latest advances in silicon and WBG devices, packaging, controller integrated circuits (ICs) and topologies, passive components (see the Passive Components column in this issue of IEEE Power Electronics Magazine , p. 12), renewable energy, transportation electrification, and more.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
