Anti-counterfeit, miniaturized, and advanced electronic substrates for medical device applications

Abstract

This paper discusses the development of advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for miniaturized electronic devices. In particular, recent developments in high density interconnect (HDI) substrate technology are highlighted. System-in-Package (SiP), embedded passives, stacked packages, and flex substrates are utilized to achieve significant reduction in size, weight, and power consumption (SWaP) in electronic devices. This paper also describes a “Package Interposer Package” (PIP) solution for integrating multiple SiPs into a single device. This mitigates the problems associated with component placement within the limited space available for individual SIP substrates. Fabrication of advanced medical substrates with technologies for parts authentication (anti-counterfeit measures) such as embedded signature circuits with zero cost adders and use of nano or micro materials as signatures are discussed.