Abstract
Antenna-in-package (AiP) technology integrates an antenna or antennas with a radio or radar transceiver die (or dies) into a standard surface-mount package. AiP technology balances performance, size, and cost well. Thus, it has been widely adopted by chipmakers for radios and radars. Many papers and patents are devoted to AiP technology. However, little is known about the history of this important antenna and packaging technology. This article aims to fill this void with a general description of early efforts that drove the development of AiP technology as we know it today.
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