Abstract
This paper presents an antenna in package (AiP) solution with embedded wafer level ball grid array (eWLB) packaging technology. The antenna implements superstrate structure configuration. A cavity in the PCB is introduced below the antenna area is introduced to increase the distance between antenna and ground on the PCB. This extends the relative bandwidth of the AiP by up to 36% for 10 dB return loss. Further, a hemisphere dielectric lens was also designed to improve the radiation performance of the AiP. Measurements show that the dielectric lens optimizes the radiation pattern of the AiP and increases the TX equivalent isotropic radiated power (EIRP) of the package from 9.0 dBm to 13.5 dBm at 76 GHz. This concept is suitable for a wide area of millimeter-wave front-end applications. The 3-dB beamwidths in the E- and H-planes of the package with lens were measured to be 38° and 53° respectively.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
